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Introduction
EdgeCortix seeks to hire a talented and experienced Electronic Engineer to join our US based team and lead the design and development of our board level hardware products, including PCBAs and reference designs featuring our proprietary AI Accelerator chips.
About Edgecortix
At Edgecortix we are a deep-tech startup revolutionizing edge computing with artificial intelligence and novel high efficiency silicon on chip design. Originating from multiple years of research, our unique AI hardware & software co-design principle and the Dynamic Neural Accelerator ® AI processor IP are geared towards positively disrupting the rapidly growing artificial intelligence edge hardware space and bring the power of AI and machine learning to all kinds of devices. Our operations are headquartered in Tokyo, Japan, with offices in Singapore, Virginia, and California in the US.
Your Role and Responsibilities:
We are seeking a highly skilled Senior Electronic Engineer to lead the design, development, and validation of our next-generation, high-speed PCIe-based hardware products. In this role, you will own the entire hardware development lifecycle, from initial architecture and high-speed schematic design to complex multi-layer PCB layout supervision, signal integrity analysis, hands-on lab bring-up, and transition to full production. You will collaborate closely with firmware, software, and mechanical teams to deliver robust, high-performance electronic products.
Key Responsibilities:
Hardware Architecture & Design: requirements specification, component selection, schematic capture, and BOM management. Lead the design and schematic capture of complex, multi-layer digital boards featuring power delivery networks (PDNs), high-speed SerDes and PCIe Gen 4/5/6 interfaces, BMCs, AI Accelerators, FPGAs, CPUs, and high-speed memory (e.g. LPDDR5x).
Signal & Power Integrity (SI/PI): Collaborate with simulation engineers or independently utilize tools to analyze and optimize robust data transmission (e.g. eye diagrams, crosstalk, jitter), as well as clean PDNs (accuracy, noise, drop, and thermal performance).
PCB Layout Supervision: Work closely with PCB layout designers and thermal mechanical engineers to guide material and stack-up selection, high-speed routing and power delivery constraints, component placement, and thermal management strategies.
Bring-up & Validation: Define and lead hands-on board bring-up, debugging, characterization, and validation in the lab.
Cross-functional Collaboration: Partner with firmware and driver teams to ensure proper operation of AI acceleration workloads and integration into deployable systems.
Compliance & Testing: Design for and support regulatory compliance testing including EMI/EMC, safety, protocol compliance, and interoperability, as well as validation of environmental reliability requirements.
Reference Design Documentation: Create and assemble reference design guides, schematics documentation, layout notes, block diagrams, operational concepts, and validation procedures to enable external customers to recreate and modify our products to do chip-down design of our AI accelerator chips. Support the Marketing team to package these materials into polished, customer-ready documentation and solutions that facilitate customer adoption and accelerate design-in activities.
Required Skills & Qualifications:
Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience: 5+ years of proven experience designing complex, high-density, multi-layer (12+ layers) PCBs that implemented high-speed protocols (e.g., 25G/56G/112G Ethernet, DDR4/DDR5, PCIe Gen 3+).
Direct experience with PCIe board development is highly preferred (Gen 3/4 minimum, Gen5/6 a plus)
EDA Tools: High proficiency with major schematic capture and PCB layout tools such as Cadence OrCAD/Allegro, or Altium Designer. Hands-on experience (directly or indirectly) with SI/PI simulation software (e.g., Ansys HFSS/SIwave, or Cadence Sigrity).
Lab/Bench Skills: Strong debugging and troubleshooting skills, proficiency with high-speed digital test equipment.
Technical Fundamentals: Deep understanding of high-speed data transmission and with power electronics design, including multi-phase buck converters and PMICs for high-power accelerators. Experience with, and appreciation of PCB fabrication, SMT assembly, and PCBA thermal management.
Location:
U.S.-based; remote work permitted. East Coast time zone preferred, with Washington, DC/DMV-area candidates a plus.
What’s in It for You
The opportunity to shape the category narrative for next-generation AI infrastructure.
The chance to join a company at the forefront of Generative and Agentic AI at the edge.
The opportunity to work alongside a world-class global team across engineering, research, product, and business.
A critical role in scaling a high-growth deep-technology company.
Benefits and Perks
Competitive salary, benefits, and equity participation.
